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主要用于光学玻璃、石英、晶体、电子元件等零件平面、球面的研磨和抛光。
平摆运动，主轴、摆轴、转速、压力、时间可根据加工零件的需要单独分开调整。
A型采用平摆运动的方式； B型C型采用椭圆运动的方式。(操作方式可选触摸屏和旋钮)
Mainly used for grinding and polishing ofplane,spherical surface of optical glass,quartz,crystal,electronic components etc.
Flat pendulum motion,spindle,pendulum shaft,rotation speed,pressure,time can be separately adjusted according to the needs of processing parts.
Type A adopts the method of horizontal pendulum motion.Type B and type C adopt elliptical motion.(Optional touch screen and knob for operation)
产品型号Product Model | GJP35.4A/B/C |
加工镜盘直径Machining dia | φ≤350mm |
主轴间距Main shaft space | 550mm |
主轴精度Precision of main shaft | ≤0.02mm |
摆幅Swing amplitude | 摆幅Swing0~200mm |
主轴转速Speed ofmain shaft | 0,70~350RPM |
主轴轴数Amount of main shaft | 4轴，螺纹Four shafts,Thread M27×3 |
摆幅摆次Swing set time | 0,10~50次/分times/min |
气压Pneumatic pressure | 0.6MPa |
机床总功率Total power | 4.8KW/380V |
机床重量Weight | 约About 1100kg |
外形尺寸Size | 2350×1250×1600(mm) |
机床的任何特殊需求都可根据用户的要求设计、制造 All machine can be designed and manufactured as required. | |
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